
01 · MEMBERS
The New AI Chip Race Is About More Than Raw Performance
Compute, packaging, memory and manufacturing capacity are becoming strategic advantages.
Read analysisFollow China’s semiconductor ecosystem from memory and AI accelerators to lithography, packaging and manufacturing capacity.

Compute, packaging, memory and manufacturing capacity are becoming strategic advantages.
Read analysis
CXMT says its LPDDR6 has entered mass production, moving China’s memory ambitions from catch-up toward next-generation products.
Read analysisBuilding a scanner is only the first step. Reliability, optics, overlay accuracy and fab qualification determine whether domestic lithography can matter commercially.
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